Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling. Includes product descriptions and industry news.
Summit Design
The EDA Technology Leader - Mentor Graphics
2024-07-28
Science, Technology, Electronics, CAD - Summit Design. Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling.