SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die and Die-to-Wafer Bonders. SET is globally renowned for the unsurpassed accuracy (±0.5 µm @ 3 sigma) and the flexibility of its flip chip bonders.
Smart Equipment Technology
Flip Chip and Chip to Chip bonding, Die Bonders, Direct Metallic Bonding: SET SAS
2024-06-08
For chip-to-chip bonding, chip-to-wafer and direct metallic bonding, SET SAS offers flexible flip chip bonders and die bonders that can align and bond components with submicron post-bond accuracy.