Electronics assembly including thick film, surface mount, chip and wire, flip chip, BGAs, CSPs and electrical test. Facilities in Chicago area and Beijing, China.
Hytel Group, Inc.Hytel Group, Inc. - Advanced Electronic Manufacturing Services
Electronics assembly including thick film, surface mount, chip and wire, flip chip, BGAs, CSPs and electrical test. Facilities in Chicago area and Beijing, China.
Hytel Group, Inc.